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Chiplet Design and Heterogeneous Integration Packaging John H. Lau 2023 edition
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¥ 21.518
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発送予定日 年9月14日 - 年9月24日
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Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2024年3月29日 |
| ISBN13 | 9789811999192 |
| 出版社 | Springer Verlag, Singapore |
| ページ数 | 525 |
| 寸法 | 150 × 220 × 10 mm · 920 g |
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