この商品を友人に教える:
Fan-Out Wafer-Level Packaging John H. Lau Softcover Reprint of the Original 1st 2018 edition
価格
¥ 17.676
税抜
遠隔倉庫からの取り寄せ
発送予定日 年10月19日 - 年10月29日
John H. Lau の新しいリリースのお知らせを受け取る
iMusicのウィッシュリストに追加
他の形態でも入手可能：
Fan-Out Wafer-Level Packaging
John H. Lau
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2018年12月16日 |
| ISBN13 | 9789811342660 |
| 出版社 | Springer Verlag, Singapore |
| ページ数 | 303 |
| 寸法 | 150 × 220 × 10 mm · 493 g |
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Paperback Book) [2023 edition] (2024)](https://imusic.b-cdn.net/images/item/original/192/9789811999192.jpg?john-h-lau-2024-chiplet-design-and-heterogeneous-integration-packaging-paperback-book&class=scaled&v=1722057566)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Paperback Book) [2021 edition] (2022)](https://imusic.b-cdn.net/images/item/original/784/9789811613784.jpg?john-h-lau-2022-semiconductor-advanced-packaging-paperback-book&class=scaled&v=1653589884)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Paperback Book) [2020 edition] (2021)](https://imusic.b-cdn.net/images/item/original/220/9789811539220.jpg?john-h-lau-2021-assembly-and-reliability-of-lead-free-solder-joints-paperback-book&class=scaled&v=1622167029)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Paperback Book) [Softcover reprint of the original 1st ed. 1991 edition] (2014)](https://imusic.b-cdn.net/images/item/original/437/9781461367437.jpg?john-h-lau-2014-solder-joint-reliability-theory-and-applications-paperback-book&class=scaled&v=1516985150)
![Cover for Glycoconjugates of the Pancreas (Hardcover Book) [2024 edition] (2027)](https://imusic.b-cdn.net/images/item/original/669/9789819947669.jpg?2027-glycoconjugates-of-the-pancreas-hardcover-book&class=scaled&v=1774521203)
![Cover for Harmonious and Symbiotic Interaction in Artificial Intelligence and Robotics: Creating Co-Experience Knowledge and Wisdom (Hardcover Book) [2021 edition] (2027)](https://imusic-static.b-cdn.net/images/missing-tall.png)
![Cover for Yu Hui · Traditional Chinese Music Research: An Insider's Exploration (Hardcover Book) [2024 edition] (2027)](https://imusic.b-cdn.net/images/item/original/931/9789819763931.jpg?yu-hui-2027-traditional-chinese-music-research-an-insider-s-exploration-hardcover-book&class=scaled&v=1774341101)
![Cover for D. S. Ramana · Arithmetical Aspects of the Large Sieve Inequality - Texts and Readings in Mathematics (Hardcover Book) [Second Edition 2026 edition] (2027)](https://imusic.b-cdn.net/images/item/original/189/9789819247189.jpg?d-s-ramana-2027-arithmetical-aspects-of-the-large-sieve-inequality-texts-and-readings-in-mathematics-hardcover-book&class=scaled&v=1788248108)
![Cover for Ram Kumar Mishra · Government Performance Management: Experiences and Lessons for India - SpringerBriefs in Business (Paperback Book) [2022 edition] (2026)](https://imusic.b-cdn.net/images/item/original/647/9789811613647.jpg?ram-kumar-mishra-2026-government-performance-management-experiences-and-lessons-for-india-springerbriefs-in-business-paperback-book&class=scaled&v=1694194972)
