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Fan-Out Wafer-Level Packaging John H. Lau 2018 edition
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発送予定日 年11月4日 - 年11月16日
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Fan-Out Wafer-Level Packaging
John H. Lau
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| リリース済み | 2018年4月13日 |
| ISBN13 | 9789811088834 |
| 出版社 | Springer Verlag, Singapore |
| ページ数 | 303 |
| 寸法 | 170 × 241 × 27 mm · 660 g |
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