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Semiconductor Advanced Packaging John H. Lau 2021 edition
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発送予定日 年9月14日 - 年9月24日
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Semiconductor Advanced Packaging
John H. Lau
498 pages, 300 Tables, color; 530 Illustrations, color; 27 Illustrations, black and white; XXII, 498
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2022年5月19日 |
| ISBN13 | 9789811613784 |
| 出版社 | Springer Verlag, Singapore |
| ページ数 | 498 |
| 寸法 | 157 × 236 × 31 mm · 800 g |
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