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Semiconductor Advanced Packaging John H. Lau 2021 edition
Semiconductor Advanced Packaging
John H. Lau
498 pages, 300 Tables, color; 530 Illustrations, color; 27 Illustrations, black and white; XXII, 498
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| リリース済み | 2021年5月18日 |
| ISBN13 | 9789811613753 |
| 出版社 | Springer Verlag, Singapore |
| ページ数 | 498 |
| 寸法 | 163 × 242 × 41 mm · 1,08 kg |
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