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Chiplet Design and Heterogeneous Integration Packaging John H. Lau 2023 edition
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発送予定日 年10月15日 - 年10月27日
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Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| リリース済み | 2023年3月28日 |
| ISBN13 | 9789811999161 |
| 出版社 | Springer Verlag, Singapore |
| ページ数 | 525 |
| 寸法 | 242 × 162 × 33 mm · 1,07 kg |
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