Aleksandar Tasic

Circuits and Systems for Future Generations of Wireless Communications - Integrated Circuits and Systems Aleksandar Tasic 2009 edition

Marc Notes: Includes bibliographical references and index. Brief Description: The world is poised for adoption of wireless technology at a mass market level. This book discusses communications circuit and system solutions for multiple communication standards and future generations of wireless communications. Biographical Note: Aleksandar Tasic: Qualcomm Incorporated, San Diego, California, USA, atasic@qualcomm.com Wouter A. Serdijn: Department of Microelectronics, Electronics Research Laboratory, Delft University of Technology, Delft, the Netherlands, w.a.serdijn@tudelft.nl Lawrence E. Larson: Radio Frequency Integrated Circuits Group University of California San Diego, La Jolla, CA, USA, larson@ece.ucsd.edu Gianluca Setti: Department of Engineering (ENDIF), University of Ferrara Advanced Research Center on Electronic Systems (ARCES), University of Bologna, gianluca.setti@unife.itJacket Description/Back: The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection with many other devices rather than with a single base station, in a variety of environments. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required. Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi) CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices. However, as batteries continue to determine the lifetime and size of mobile equipment, further extension of capabilities of wearable and wireless devices will depend critically on the integrated circuits and systems solutions. The demand for multifunctional and multi-mode wireless-capable devices is accompanied by many significant challenges at system, circuit, and technology levels. In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed. Table of Contents: 1. Introduction -- 2. A Multimode Radio Transceiver for Cellular Applications / John Groe -- 3. Reconfigurable Multi-Band OFDM UWB Receivers: Circuits and System Considerations Luca Baldini / Danilo Manstretta, Tomaso Erseghe, Nicola Laurenti, Antonio Liscidini, R. Castello -- 4. Low Power UWB Circuits: Front-End Building Blocks / Tommy Tsang, Kuan-Yu Lin, Karim Allidina, Mourad El-Gamal -- 5. CMOS IR-UWB Transceiver System Design for Contact-Less Chip Testing Applications / Yanjie Wang, Ali M. Niknejad, Vincent Gaudent, Kris Iniewski -- 6. Multi-mode Power Amplifiers for Wireless Handset Applications / Junxiong Deng, Lawrence E. Larson -- 7. Polyphase Multipath Circuits for Cognitive Radio and Flexible Multi-phase Clock Generation / Eric A. M. Klumperink, Xiang Gao, Bram Nauta -- 8. IIP2 Improvement Techniques for Multi-standard Mobile Radio / Mohammad B. Vahidfar, Omid Shoaei -- 9. Multi-standard Continuous-Time Sigma-Delta Converters for 4G Radios / Yi Ke, Jan Craninkx, Georges Gielen -- 10. Power Efficient Reconfigurable Baseband Filters for Multimode Radios / Pieter Crombez, Jan Craninckx, Michiel Steyaert -- 11. An Adaptive Digital Front-End for Multi-mode Wireless Receivers / Gernot Hueber, Rainer Stuhlberger, Andreas Springer -- 12. FEC Decoders for Future Wireless Devices: Scalability Issues and Multi-standard Capabilities / John Dielissen, Nur Engin, Sergei Sawitzki, Kees van Berkel -- Index.

Contributor Bio:  Serdijn, Wouter A Serdijn, Delft University of Technology, The Netherlands. Contributor Bio:  Larson, Lawrence E Larson is a professor at the University of California at San Diego, where he holds the Communications Industry Chair.