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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging Xing-Chang Wei 第1 版
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
340 pages, 261 black & white illustrations, 10 black & white tables, 123 black & white halftones, 13
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| リリース済み | 2017年5月25日 |
| ISBN13 | 9781138033566 |
| 出版社 | Taylor & Francis Ltd |
| ページ数 | 322 |
| 寸法 | 241 × 163 × 23 mm · 636 g |
| 言語 | 英語 |
