Microelectronics Packaging Handbook: Technology Drivers Part I - R.R. Tummala - Books - Chapman and Hall - 9780412084317 - January 31, 1997
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Microelectronics Packaging Handbook: Technology Drivers Part I 2nd ed. 1997 edition

R.R. Tummala

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Microelectronics Packaging Handbook: Technology Drivers Part I 2nd ed. 1997 edition

Electronics has become the largest industry, surpassing agriCUlture, auto. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.


720 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 31, 1997
ISBN13 9780412084317
Publishers Chapman and Hall
Pages 720
Dimensions 243 × 167 × 48 mm   ·   1.09 kg
Language English   French  

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