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Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness Josef Lutz Third Edition 2026 edition
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¥ 32.055
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発送予定日 2027年1月4日 - 2027年1月6日
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Semiconductor Power Devices: Volume 2: Packaging, Thermal aspects, Reliability and Ruggedness
Josef Lutz
This new edition of the book Semiconductor Power Devices is now divided into two volumes. Additional chapters discuss electromagnetic disturbances, oscillations, and the integration of power electronic systems, making this volume an essential resource for engineers and researchers working on robust and efficient power device design.
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| 発売予定 | 2026年12月24日 |
| ISBN13 | 9783032234889 |
| 出版社 | Springer Nature Switzerland AG |
| ページ数 | 361 |
| 寸法 | 150 × 220 × 20 mm · 574 g (重量（概算）) |
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