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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation Lei He
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System-in-Package: Electrical and Layout Perspectives - Foundations and Trends (R) in Electronic Design Automation
Lei He
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
94 pages
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2011年6月30日 |
| ISBN13 | 9781601984586 |
| 出版社 | now publishers Inc |
| ページ数 | 94 |
| 寸法 | 156 × 234 × 5 mm · 145 g |
| 言語 | 英語 |
