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Three-dimensional Integration and Modeling: a Revolution in Rf and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics) Jong-hoon Lee 第1 版
Three-dimensional Integration and Modeling: a Revolution in Rf and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)
Jong-hoon Lee
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends. Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2007年11月1日 |
| ISBN13 | 9781598292442 |
| 出版社 | Morgan and Claypool Publishers |
| ページ数 | 108 |
| 寸法 | 191 × 235 × 6 mm · 213 g |
| 言語 | 英語 |
