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Design of 3D Integrated Circuits and Systems - Devices, Circuits, and Systems Sung Kyu Lim 第1 版
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Design of 3D Integrated Circuits and Systems - Devices, Circuits, and Systems
Sung Kyu Lim
This book covers 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as
324 pages
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2020年9月30日 |
| ISBN13 | 9780367655921 |
| 出版社 | Taylor & Francis Ltd |
| ページ数 | 324 |
| 寸法 | 232 × 156 × 27 mm · 496 g |
| 言語 | 英語 |
| シリーズ編集者 | Iniewski, Krzysztof (Redlen Technologies Inc., Canada.) |
![Cover for Sung Kyu Lim · Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Paperback Book) [2013 edition] (2014)](https://imusic.b-cdn.net/images/item/original/962/9781489986962.jpg?sung-kyu-lim-2014-design-for-high-performance-low-power-and-reliable-3d-integrated-circuits-paperback-book&class=scaled&v=1436646486)
![Cover for Sung Kyu Lim · Practical Problems in VLSI Physical Design Automation (Paperback Book) [Softcover reprint of hardcover 1st ed. 2008 edition] (2010)](https://imusic.b-cdn.net/images/item/original/823/9789048176823.jpg?sung-kyu-lim-2010-practical-problems-in-vlsi-physical-design-automation-paperback-book&class=scaled&v=1410557638)
