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Thermal Imaging in Biosystems Engineering: Principles and Applications
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¥ 33.013
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発送予定日 年9月29日 - 年10月2日
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Thermal Imaging in Biosystems Engineering: Principles and Applications
This book provides an overview of infrared thermal imaging as an advanced, non-contact, and non-destructive tool in biosystems engineering.
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| 発売予定 | 2026年9月21日 |
| ISBN13 | 9789819231461 |
| 出版社 | Springer Verlag, Singapore |
| ページ数 | 254 |
| 寸法 | 150 × 220 × 20 mm · 541 g (重量（概算）) |
| 編集者 | Jayas, Digvir S. |
| 編集者 | Kheiralipour, Kamran |
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