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Electrical Design of Through Silicon Via Softcover reprint of the original 1st ed. 2014 edition
Electrical Design of Through Silicon Via
This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
280 pages, 249 Tables, color; 249 Illustrations, black and white; IX, 280 p. 249 illus.
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2016年9月27日 |
| ISBN13 | 9789401779494 |
| 出版社 | Springer |
| ページ数 | 280 |
| 寸法 | 150 × 220 × 10 mm · 412 g |
| 編集者 | Kim, Joungho |
| 編集者 | Lee, Manho |
| 編集者 | Pak, Jun So |