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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok Softcover Reprint of the Original 1st 2018 edition
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2019年1月5日 |
| ISBN13 | 9783030085612 |
| 出版社 | Springer Nature Switzerland AG |
| ページ数 | 115 |
| 寸法 | 150 × 220 × 10 mm · 185 g |
| 言語 | ドイツ語 |