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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability Tae-Kyu Lee 2015 edition
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発送予定日 年12月4日 - 年12月16日
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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Tae-Kyu Lee
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
253 pages, 69 black & white illustrations, 81 colour illustrations, 18 black & white tables, biograp
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| リリース済み | 2014年11月6日 |
| ISBN13 | 9781461492658 |
| 出版社 | Springer-Verlag New York Inc. |
| ページ数 | 253 |
| 寸法 | 163 × 241 × 16 mm · 553 g |
| 言語 | 英語 |
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