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Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology Kazuo Kondo 2014 Edition
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Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology
Kazuo Kondo
In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes.
298 pages, 115 black & white illustrations, 75 colour illustrations, 12 black & white tables, biogra
| メディア | 書籍 Hardcover Book (ハードカバー付きの本) |
| リリース済み | 2013年11月21日 |
| ISBN13 | 9781461491750 |
| 出版社 | Springer-Verlag New York Inc. |
| ページ数 | 282 |
| 寸法 | 155 × 235 × 18 mm · 585 g |
| 言語 | 英語 |
| 編集者 | Akolkar, Rohan N. |
| 編集者 | Barkey, Dale P. |
| 編集者 | Kondo, Kazuo |
| 編集者 | Yokoi, Masayuki |
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