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Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics Tong, Xingcun Colin, Ph.D. 2011 edition
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発送予定日 年11月27日 - 年12月9日
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Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics
Tong, Xingcun Colin, Ph.D.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.
550 pages, 26 black & white tables, biography
| メディア | 書籍 Paperback Book (ソフトカバーで背表紙を接着した本) |
| リリース済み | 2013年2月25日 |
| ISBN13 | 9781461427926 |
| 出版社 | Springer-Verlag New York Inc. |
| ページ数 | 618 |
| 寸法 | 236 × 243 × 31 mm · 884 g |
| 言語 | 英語 |
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