Creep-Rupture Behavior of a Woven Ceramic Matrix Composite at Elevated Temperatures in a Humid Environment - Jennifer L Ryba - 書籍 - Biblioscholar - 9781249595939 - 2012年10月9日
カバー画像とタイトルが一致しない場合、正しいのはタイトルです

Creep-Rupture Behavior of a Woven Ceramic Matrix Composite at Elevated Temperatures in a Humid Environment

価格
¥ 4.032
税抜

遠隔倉庫からの取り寄せ

発送予定日 年12月1日 - 年12月17日
クリスマスプレゼントは1月31日まで返品可能です
Jennifer L Ryba の新しいリリースのお知らせを受け取る
iMusicのウィッシュリストに追加

まだ評価がありません

Publisher Marketing: For high temperature applications, ceramic matrix composites (CMCs) are ideal because of their high strength and toughness, low density, and durability. A CMC manufactured with silicon carbide fiber and silicon carbide matrix, the focus of this research, maintains its strength and toughness at low and high temperatures, but experiences embrittlement at intermediate temperatures (450-900-C). This study focused on moisture and temperature effects on the embrittlement and stress-rupture life of the SiC/SiC CMC Syl-iBN/BN/SiC. The Syl-iBN/BN/SiC is composed of Sylramic" fibers with an in-situ layer of boron nitride (Syl-iBN), boron nitride interphase (BN), and SiC matrix. Stress rupture tests and monotonic tests were performed on the specimens. Tests were conducted under 100% humidity and laboratory air environments at three temperatures, 450-C, 750-C, and 950-C. These temperatures were chosen because they fall below the intermediate range, within the range, and above the range, respectively. This study found that while this CMC does experience embrittlement at intermediate temperatures, it also occurs at temperatures above the intermediate range. Scanning Electron Microscopy (SEM) analysis showed the embrittlement and pesting in the specimens increased with time, temperature, and moisture exposure, leading to premature failure. An analysis of the data confirmed that with increase in temperature and exposure to moisture, the stress-rupture life of the Syl-iBN/BN/SiC was considerably shortened.

メディア 書籍     Paperback Book   (ソフトカバーで背表紙を接着した本)
リリース済み 2012年10月9日
ISBN13 9781249595939
出版社 Biblioscholar
ページ数 122
寸法 189 × 246 × 7 mm   ·   176 g