Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings

Name: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings

This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

358 pages, black & white illustrations

メディア	書籍 Paperback Book (ソフトカバーで背表紙を接着した本)
リリース済み	2014年6月5日
ISBN13	9781107408715
出版社	Cambridge University Press
ページ数	358
寸法	152 × 229 × 24 mm · 524 g
言語	英語
編集者	Lin, Qinghuang (IBM T J Watson Research Center, New York)
編集者	Ryan, E. Todd
編集者	Wu, Wen-li (National Institute of Standards and Technology, Maryland)
編集者	Yoon, Do Yeung (Seoul National University)