III–V Compound Semiconductors: Integration with Silicon-Based Microelectronics - - 書籍 - Taylor & Francis Ltd - 9780367383268 - 2019年9月23日
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III–V Compound Semiconductors: Integration with Silicon-Based Microelectronics 第1 版

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Silicon-based microelectronics has steadily improved in various performance-to-cost metrics. But after decades of processor scaling, fundamental limitations and considerable new challenges have emerged. The integration of compound semiconductors is the leading candidate to address many of these issues and to continue the relentless pursuit of more powerful, cost-effective processors.





III-V Compound Semiconductors: Integration with Silicon-Based Microelectronics covers recent progress in this area, addressing the two major revolutions occurring in the semiconductor industry: integration of compound semiconductors into Si microelectronics, and their fabrication on large-area Si substrates. The authors present a scientific and technological exploration of GaN, GaAs, and III-V compound semiconductor devices within Si microelectronics, building a fundamental foundation to help readers deal with relevant design and application issues.





Explores silicon-based CMOS applications developed within the cutting-edge DARPA program





Providing an overview of systems, devices, and their component materials, this book:







Describes structure, phase diagrams, and physical and chemical properties of III-V and Si materials, as well as integration challenges







Focuses on the key merits of GaN, including its importance in commercializing a new class of power diodes and transistors







Analyzes more traditional III-V materials, discussing their merits and drawbacks for device integration with Si microelectronics







Elucidates properties of III-V semiconductors and describes approaches to evaluate and characterize their attributes







Introduces novel technologies for the measurement and evaluation of material quality and device properties







Investi

603 pages

メディア 書籍     Paperback Book   (ソフトカバーで背表紙を接着した本)
リリース済み 2019年9月23日
ISBN13 9780367383268
出版社 Taylor & Francis Ltd
ページ数 603
寸法 150 × 220 × 10 mm   ·   453 g
言語 英語  
編集者 Dadgar, Armin
編集者 Li, Tingkai
編集者 Mastro, Michael

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